Technical Specifications
S450-B
Key Features
FEATURES：
1. Close loop force control
2. EFO controlled by CPLD
3. DSP phase lock,stable ultrasonic output
4. Drive by electricity without compressed air
5. Self-study English GUl for advanced process
6. Unique tailless bumping process and super adaptability for soft substrates
7. Bond head designed by parallelogram support large module of deep access
Technical Specifications
Bond Head X-Y Range
X=15mm,Y=15mm
Lifting Table Z Range
0~18mm
Bond Head Z Range
18mm
Lifting Table X-Y Range
250mm×270mm
Type of Bonding Tools
16mm/19mm
Spool
Standard :1/2 inch；Optional : 2 inch
Bond Force
1~250g
Bond Power
Numerical control,1000x subdivision
Clamping Table
Maximum Temperature 200℃
Input Voltage
220V±10%@50~60Hz
Power Consumption
≤500W
Weight
GW.≈47kg,NW.≈70kg
Footprint
≤620mm x 640mm x 450mm(W x D x H)
Performance
High Precision
Build Standard
Industrial Grade