Technical Specifications
ZH6000-B
Key Features
Product Features
- Large bonding working area
- Fixed-length & fixed-height loop control function
- Piezoelectric ultrasonic motor tail wire control mechanism
- Compatible with 16 mm and 19 mm capillaries
- Real-time BMS bonding spot inspection
- Real-time deformation monitoring
- Real-time ultrasonic energy monitoring
- Large bonding working area
- Fixed-length & fixed-height loop control function
- Piezoelectric ultrasonic motor tail wire control mechanism
- Compatible with 16 mm and 19 mm capillaries
- Real-time BMS bonding spot inspection
- Real-time deformation monitoring
- Real-time ultrasonic energy monitoring
Technical Specifications
Application Scope
Discrete devices, microwave components, lasers, optical communication devices, sensors, MEMS, SAW devices, RF modules, power devices, etc.
Bonding Accuracy
±3 μm @ 3sigma
Bonding Working Area
X-axis: 305 mm, Y-axis: 457 mm, rotation range: 0~180°
Ultrasonic Power Range
0~4 W precise control with stepped flexible energy output
Loop Control
Fully programmable
Maximum Cavity Depth
12 mm
Bonding Materials
Gold wire (18–75 μm), copper wire (18–75 μm), selected alloy wires
Bond Force
0–220 g
Capillary Length Options
16 mm, 19 mm
Bonding Speed
≥5 wires per second
Operating System
Windows
Equipment Net Weight
1.2 T
Performance
High Precision
Build Standard
Industrial Grade