Technical Specifications
High-Precision Dispensing & Die Attach Integrated Machine DA0300SE
Key Features
Product Features：
- Supports Flexible Multi-Reference Die Attach
- High-Precision Force Control with Accuracy ±2 g
- Transfer Stage Auxiliary High-Precision Positioning (Optional)
- Top & Bottom Vision High-Precision Positioning Function
- Inline Production, Worktable Mode Optional
- Fast & High-Precision Horizontal Rotary Head
- Flexible Process Flow, Free Combination of Working Procedures, Single Procedure Disable Available
- Integrated Inline Contact Height Measurement, Supports Dispensing Needle Height Detection
- Various Standard Pre-set Dispensing Patterns, Custom Patterns & Pattern Overlay Supported (Optional)
- Multiple PR Recognition Modes (Template Matching, Edge Positioning, Reference Pattern Positioning, Geometric Center Positioning, etc.)
Technical Specifications
Position Accuracy
±3 μm @ 3sigma
Nozzle Quantity
12 (with height measurement function)
Angle Accuracy
±0.15° @ 3sigma
Dispensing Valve
Musashi Precision Pneumatic Control Valve SUPER ΣCMIII
Height Measurement Accuracy
±1μm
Dispensing Valve
Musashi Precision Pneumatic Control Valve SUPER ΣCMIII
Force Control Accuracy
±2g
Adhesive Type
Epoxy
Die Size
Min 0.2 mm × 0.2 mm, Max 15 mm × 15 mm
Epoxy Volume
3cc、5cc、10cc
Travel Range
X=386 mm, Y=716 mm, Z=50 mm
Waffle Pack/Gel-Pak size
2-inch, compatible with 4-inch
Bonding Force
15~500g
Waffle Pack/Gel-Pak Quantity
30 pcs of 2-inch OR 22 pcs of 2-inch + 2 pcs of 4-inch
Minimum adhesive spot diameter
∅0.25mm
Max Cavity Depth
15 mm
Operating System
Windows
Performance
High Precision
Build Standard
Industrial Grade