Technical Specifications
S450P-BW
Key Features
FEATURES：
1. High precision close loop force control (Accuracy within 1g)
2. High stability of bond point
3. One key switch frequency
4. Drive by electricity without compressed air
5. Unique tailless bumping process and super adaptability for soft substrates
6. Bond head designed by parallelogram support large module of deep access
Technical Specifications
Bond Wire
Au(15~75μm),Pt(18~25μm),Cu(18~25μm),Ag(18~50μm),Gold Ribbon(12.7 x 50μm~25.4 x 300μm)
Bond Head Z Range
18mm
Device Depth
Ball Bonding Max:15mm,Wedge Bonding Max:21mm
Bond Head X-Y Range
X=15mm,Y=15mm
Type of Bonding Tools
16mm Ball Bonding Tools； 19mm,25mm Wedge Bonding Tools
Lifting Table Z Range
0~18mm
Lifting Table X-Y Range
250mm×270mm
Input Voltage
220V±10%@50~60Hz
Spool
Standard :1/2 inch；Optional : 2 inch
Power Consumption
≤500W
Bond Power
Numerical control,1000x subdivision
Weight
GW.≈47kg,NW.≈70kg
Clamping Table
Maximum Temperature 200℃
Footprint
≤620mm x 640mm x 450mm(W x D x H)
Performance
High Precision
Build Standard
Industrial Grade