Technical Specifications
S450-RW
Key Features
FEATURES：
1. Close loop force control
2. DSP phase lock, stable ultrasonic output
3. Excellent fine wire control and super adaptability for soft substrates
4. Drive by electricity without compressed air
5. Self-study English GUl for advanced process
Technical Specifications
Bond Wire
Gold Ribbon(50 x 12.5μm~300 x 25.4μm)
Bond Head Z Range
18mm
Device Depth
Max:21mm
Bond Head X-Y Range
X=15mm,Y=15mm
Type of Bonding Tools
16mm Ball Bonding Tools； 19mm,25mm Wedge Bonding Tools
Lifting Table Z Range
0~18mm
Spool
Standard :1/2 inch；Optional : 2 inch
Lifting Table X-Y Range
250mm×270mm
Bond Force
1~250g
Power Consumption
≤500W
Bond Power
Numerical control,1000x subdivision
Weight
GW.≈47kg,NW.≈70kg
Clamping Table
Maximum Temperature 200℃
Footprint
≤620mm x 640mm x 450mm(W x D x H)
Performance
High Precision
Build Standard
Industrial Grade