Technical Specifications
S450-BW
Key Features
FEATURES：
1. Close loop force control
2. EFO controlled by CPLD
3. DSP phase lock, stable ultrasonic output
4. Drive by electricity without compressed air
5. Self-study English GUl for advanced process
6. Unique tailless bumping process and super adaptability for soft substrates
Technical Specifications
Bond Wire
Au(15~75um),Pt(18~25μm),Ag(18~50μm),Al(18~100μm)
Bond Head Z Range
18mm
Device Depth
Ball Bonding Max:15mm,Wedge Bonding Max:21mm
Bond Head X-Y Range
X=15mm,Y=15mm
Type of Bonding Tools
16mm Ball Bonding Tools； 19mm,25mm Wedge Bonding Tools
Lifting Table Z Range
0~18mm
Spool
Standard :1/2 inch；Optional : 2 inch
Input Voltage
220V±10%@50~60Hz
Bond Force
1~250g
Power Consumption
≤500W
Bond Power
Numerical control,1000x subdivision
Weight
GW.≈47kg,NW.≈70kg
Clamping Table
Maximum Temperature 200℃
Footprint
≤620mm x 640mm x 450mm(W x D x H)
Performance
High Precision
Build Standard
Industrial Grade